ret y rt - ideal for printed circuit board - high case dielectric strength - high surge current capability - ul recognized file # e-326243 - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test v rrm v v rms v v dc v i 2 ta 2 s i r a vdis kv t j o c t stg o c document number: ds_d1312018 version: h13 operating junction temperature range - 55 to +150 storage temperature range - 55 to +150 note 1: pulse test with pw=300 s,1% duty cycle dielectric strength (terminal to case, ac 1minute) 2 typical thermal resistance r jc r jl r ja 5.25.5 13.7 o c/w maximum instantaneous forward voltage (note 1) i f = 1.5 a v f 1.0 v maximum dc reverse current at rated dc blocking voltage 10 a peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 90 a rating of fusing ( t < 8.3ms) 35 maximum dc blocking voltage 600 800 1000 maximum average forward current without heat sink t a =29 60hz sine wave resistance load with heat sink t c =140 i f(av) 1.23.0 maximum repetitive peak reverse voltage 600 800 1000 maximum rms voltage 420 560 700 mounting torque: 0.8 n.m max. m ax i m u m rat i n gs an d elect ri cal ch aract eri st i cs (t a =25 unless otherwise noted) param et er sy m bol u r3 k b 6 0 u r3 k b 8 0 u r3 k b 1 0 0 u n i t d3k m ech an i cal dat a case: d3k weight: 1.24 g (approximately) ur3kb60 thru UR3KB100 taiwan semiconductor glass passivated brid g e rectifiers feat u res - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec downloaded from: http:///
part n o. part n o. ur3kb60 ur3kb60 rat i n gs an d ch aract eri st i cs cu rv es (ta=25 unless otherwise noted) document number: ds_d1312018 version: h13 ur3kb60 c2g c2 g green compound ex am ple preferred p/n pack i n g code green com pou n d code descri pt i on ur3kb60 c2 c2 ur3kbx0 (note 1) c2 suffix "g" d3k 1,500 / box note 1: "x" defines voltage from 600v (ur3kb60) to 1000v (UR3KB100) ur3kb60 thru UR3KB100 taiwan semiconductor orderi n g i n form at i on pack i n g code green com pou n d code pack age pack i n g 0 0.5 1 1.5 2 2.5 3 3.5 0 20 40 60 80 100 120 140 160 average forward a current (a) ambient temperature ( o c) fig.1 maximum derating curve for output current without heat sink with heat sink 0 10 20 30 40 50 60 70 80 90 100 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig.2 maximum forward surge current 8.3ms single half sine-wave 0.1 1 10 100 1000 0 20 40 60 80 100 120 140 instantaneous reverse a current ( a) percent of rated peak reverse voltage (%) fig. 3 typical reverse characteristics t j =25 t j =125 0.1 1 10 100 0.4 0.6 0.8 1 1.2 1.4 instantaneous forward a current (a) instantaneous forward voltage (v) fig. 4 typical forward characteristics t j =25 t j =125 downloaded from: http:///
min max min max a 13.50 14.10 0.531 0.555 b 0.70 1.40 0.028 0.055 c 11.70 12.30 0.461 0.484 d 10.50 11.10 0.413 0.437 e 11.70 12.30 0.461 0.484 f 1.10 1.40 0.043 0.055 g 3.51 4.11 0.138 0.162 h 6.70 7.30 0.264 0.287 i 1.10 1.50 0.043 0.059 j 1.05 1.25 0.041 0.049 k 0.66 0.86 0.026 0.034 l 2.90 3.30 0.114 0.130 m 2.40 2.80 0.094 0.110 n 3.10 3.40 0.122 0.134 o 1.00 1.40 0.039 0.055 p 0.40 0.80 0.016 0.031 q 1.80 2.40 0.071 0.094 r 0.40 0.60 0.016 0.024 p/n = specific device code g = green compound yww = date code f = factory code document number ds_d1312018 version:h13 m ark i n g di agram ur3kb60 thru UR3KB100 taiwan semiconductor pack age ou t li n e di m en si on s dim. unit(mm) unit(inch) 0 1 2 3 4 5 6 7 0123 power dissipation(w) forward rectified current io (a) fig. 5 forward power dissipation downloaded from: http:///
ret y rt assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number ds_d1312018 version:h13 ur3kb60 thru UR3KB100 taiwan semiconductor n ot ic e specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf, downloaded from: http:///
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